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Requirement |
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Method of test |
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T.C.R. |
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TCR≤±350×10-6/℃ |
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-55℃/20℃ |
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20℃ /+155℃ |
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Resistance >10Ω |
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Duration |
time 1000h |
Endurance at 70℃ |
△R≤±(5%R+0.1Ω) |
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Check the resistance and appearance at |
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48h,500h,1000h |
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Withstand voltage |
No |
breakdown |
or |
V-block |
Method, 1.42times insulation |
flashover. |
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voltage , 1 min |
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Method:Use the tin stove to test |
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Terminal is well covered |
Temperature of solder:260±5℃(RoHS) |
Solderability |
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with |
solder and |
the |
Dwell depth in solder:The distance between |
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solder can freely flow . |
resistor body and solder surface is 20-0.5 mm |
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Dwell time in solder:3±0.5S(RoHS) |
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Test time:5S |
Over-load |
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△R≤±(1%R+0.05Ω) |
Test voltage:2.5 times of rated voltage |
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or 2times of limit voltage,choose the |
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lower. |
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Terminal strength |
△R≤±(1%R+0.05Ω) |
Tension:10N |
Curve,twist 180°,two times |
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Resistance |
to |
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350℃±10℃ 3.5S±0.5S |
△R≤±(1%R+0.05Ω) |
The distance between resistor body and |
soldering heat |
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solder surface is 2+0.5mm |
Fast temperature |
△R≤±(1%R+0.05Ω) |
-55℃/155℃ |
change |
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Frequency:10HZ-500HZ |
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amplitude:0.75 mm or Acceleration |
Vibration |
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△R≤±(1%R+0.05Ω) |
98m/S2 |
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Test time:6h,Check the appearance |
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Resistance |
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——Dry heat |
Climate category |
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——damp heat first cycle |
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△R≤±(1%R+0.05Ω) |
low pressure |
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——damp heat other cycles |
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——DC load |
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ΔR≤±(5%R+0.1Ω) |
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According to GB/T5729 4.24.2.2 |
Steady damp-heat |
Insulation Resistance≥ |
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100MΩ |
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Endurance at |
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△ R≤±(5%R+0.1Ω) |
155℃ |
1000h |
upper-limit |
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nsulation Resistance ≥ |
No visible damage . |
temperature |
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1GΩ |
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